SPAWC
 
 

 

TECHNICAL PROGRAM COMMITTEE (TPC)

Chair

  • BONNET Christian, EURECOM Institute (France)

Co-Chairs

  • LENARDI Massimiliano, Hitachi Europe SAS (France)
  • KOMAKI Shozo, Osaka University (Japan)
  • WEN GuangJun, UESTC (China),

Members

  • BERBINEAU Marion, INRETS-LEOST (France)
  • BONNIN Jean-Marie, ENST Bretagne (France)
  • CLAUSEN Thomas, LIX (France)
  • EL Zein Ghais, IETR/INSA (France)
  • ERNST Thierry, INRIA (France)
  • FESTAG Andreas, NEC Europe SAS (Germany)
  • GERLA Mario, UCLA (USA)
  • GIERLICH Hans W., HEAD Acoustic (Germany)
  • LANDRAC Gabrielle, GET /ENST Bretagne (France)
  • LE DEVENDEC Marc, ERO (Denmark)
  • LE ROUX Yvon, GET/ENST Bretagne (France)
  • MARKS Bev, EBU Technical Department (UK)
  • MOKADDEM Abdel Kader, Renault (France)
  • MIURA Ryu, NICT, Singapore
  • NIU ZhiSheng TsingHua University (China)
  • PARK Jong-hyun, ETRI (Korea)
  • PAU Giovanni, UCLA (USA)
  • PRATHOMBUTR Passakon, NECTEC (Thailand)
  • RICHARD Bishop, IVSource (USA)
  • SCHNIEDER Eckehard, Braunschweig Univ. (Germany)
  • SHANKARJaya P, I2R (Singapore)
  • SHAO Zhen Hai, Cubic (Singapore)
  • VALLEE Fabienne, Technpôle Brest Iroise (France)
  • XIAO WenDong I2R (Singapore)
  • WAGNER Michael, DaimlerChrysler (Germany)
  • WIESBECK Werner, Karlsruhe University (Germany)
  • ZHANG Yan, Simula Research Lab. (Norway)